![Apparatus and Process for Cutting Adhesive Labels](/abs-image/US/2016/01/21/US20160016323A1/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: Apparatus and Process for Cutting Adhesive Labels
- 申请号:US14867294 申请日:2015-09-28
- 公开(公告)号:US20160016323A1 公开(公告)日:2016-01-21
- 发明人: Alan GREEN , Dennis R. BENOIT
- 申请人: Avery Dennison Corporation
- 主分类号: B26D7/08
- IPC分类号: B26D7/08 ; B32B38/10 ; B32B38/00 ; B26D1/36 ; B32B37/08
摘要:
A method and apparatus are provided for die cutting label stock comprising a facestock, an adhesive and optionally a liner to form labels where a liner of the linered pressure sensitive adhesive label stock may be a thin or ultrathin liner.
公开/授权文献:
- US09724837B2 Apparatus and process for cutting adhesive labels 公开/授权日:2017-08-08
IPC结构图谱:
B | 作业;运输 |
--B26 | 手动切割工具;切割;切断 |
----B26D | 切割;用于切断,例如切割、打孔、冲孔、冲裁的机器的通用零件 |
------B26D7/00 | 用于切割、切下、冲裁、冲孔、打孔或用除切割以外的方法切断的设备的零件 |
--------B26D7/08 | .处理工件或切割元件使其易于切割的装置 |