发明申请
US20150380277A1 UNDERFILL SHEET, UNDERFILL SHEET INTEGRATED WITH TAPE FOR GRINDING REAR SURFACE, UNDERFILL SHEET INTEGRATED WITH DICING TAPE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
审中-公开
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基本信息:
- 专利标题: UNDERFILL SHEET, UNDERFILL SHEET INTEGRATED WITH TAPE FOR GRINDING REAR SURFACE, UNDERFILL SHEET INTEGRATED WITH DICING TAPE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- 专利标题(中):一体化用于研磨后表面的垫片的底板,与定位带一体化的底板以及制造半导体器件的方法
- 申请号:US14769441 申请日:2014-02-07
- 公开(公告)号:US20150380277A1 公开(公告)日:2015-12-31
- 发明人: Kosuke Morita , Naohide Takamoto , Hiroyuki Hanazono , Akihiro Fukui
- 申请人: NITTO DENKO CORPORATION
- 申请人地址: JP Ibaraki-shi, Osaka
- 专利权人: NITTO DENKO CORPORATION
- 当前专利权人: NITTO DENKO CORPORATION
- 当前专利权人地址: JP Ibaraki-shi, Osaka
- 优先权: JP2013-032386 20130221
- 国际申请: PCT/JP2014/052931 WO 20140207
- 主分类号: H01L21/56
- IPC分类号: H01L21/56 ; C08J5/18 ; H01L23/00 ; B32B27/38 ; H01L21/683 ; H01L23/29
摘要:
An object of the present invention is to provide an underfill sheet that enables suitable filling of unevenness of a circuit surface of a semiconductor element, a suitable connection of a terminal of the semiconductor element and a terminal of an adherend, and suppression of outgas. The present invention relates to the underfill sheet having a viscosity of 1,000 Pa·s to 10,000 Pa·s at 150° C. and 0.05 to 0.20 rotations/min; and a minimum viscosity of 100 Pa·s or more at 100 to 200° C. and 0.3 to 0.7 rotations/min.
摘要(中):
本发明的目的是提供一种能够适当地填充半导体元件的电路表面的不均匀性,半导体元件的端子和被粘物的端子的适当连接以及抑制排气的底部填充片。 本发明涉及在150℃下粘度为1,000Pa·s〜10,000Pa·s和0.05〜0.20转/分钟的底填料片; 在100〜200℃,最低粘度为100Pa·s以上,0.3〜0.7转/分钟。
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/02 | .半导体器件或其部件的制造或处理 |
----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
--------------H01L21/56 | ....封装,例如密封层、涂层 |