![Method of Forming Ga2O3-Based Crystal Film and Crystal Multilayer Structure](/abs-image/US/2015/06/25/US20150179445A1/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: Method of Forming Ga2O3-Based Crystal Film and Crystal Multilayer Structure
- 专利标题(中):形成Ga2O3基晶体膜和晶体多层结构的方法
- 申请号:US14581893 申请日:2014-12-23
- 公开(公告)号:US20150179445A1 公开(公告)日:2015-06-25
- 发明人: Kohei SASAKI , Masataka Higashiwaki
- 申请人: TAMURA CORPORATION , National Institute of Information and Communications Technology
- 优先权: JP2013-265771 20131224
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; H01L29/04 ; H01L29/24
摘要:
A method of forming a Ga2O3-based crystal film includes epitaxially growing a Ga2O3-based crystal film on a (001)-oriented principal surface of a Ga2O3-based substrate at a growth temperature of not less than 750° C. A crystal multilayer structure includes a Ga2O3-based substrate with a (001)-oriented principal surface, and a Ga2O3-based crystal film formed on the principal surface of the Ga2O3-based substrate by epitaxial growth. The principal surface has a flatness of not more than 1 nm in an RMS value.
摘要(中):
形成Ga 2 O 3系晶体膜的方法包括在不低于750℃的生长温度的Ga2O3基基板的(001)取向主面上外延生长Ga 2 O 3系晶体膜。晶体多层结构 包括具有(001)取向主表面的Ga 2 O 3基基板和通过外延生长在Ga2O3基基板的主表面上形成的Ga 2 O 3系晶体膜。 主面的RMS值平坦度不大于1nm。
公开/授权文献:
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/02 | .半导体器件或其部件的制造或处理 |