发明申请
US20150171378A1 METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT AND METHOD FOR PATTERNING AN ORGANIC, OPTOELECTRONIC COMPONENT
有权
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基本信息:
- 专利标题: METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT AND METHOD FOR PATTERNING AN ORGANIC, OPTOELECTRONIC COMPONENT
- 专利标题(中):用于生产光电元件的方法和用于绘制有机光电元件的方法
- 申请号:US14419964 申请日:2013-08-07
- 公开(公告)号:US20150171378A1 公开(公告)日:2015-06-18
- 发明人: Michael Popp , Simon Schicktanz
- 申请人: OSRAM OLED GMBH
- 优先权: DE102012214325.4 20120810
- 国际申请: PCT/EP2013/066576 WO 20130807
- 主分类号: H01L51/56
- IPC分类号: H01L51/56 ; H01L51/44 ; H01L51/52
摘要:
Various embodiments may relate to a method for producing an organic optoelectronic component, including forming a first layer on or over a substrate, the substrate including at least one contact pad of the organic optoelectronic component, at least one electrode of the organic optoelectronic component being electrically connected to the at least one contact pad, forming a second layer on or over the first layer, and removing at least the second layer in at least one region of the substrate with the first layer and the contact pad. The adhesion of the substance or of the substance mixture of the first layer on the interface with the substrate is less than the adhesion of the substance or of the substance mixture of the second layer on the interface with the substrate.
摘要(中):
各种实施方案可涉及用于生产有机光电子部件的方法,包括在衬底上或衬底上形成第一层,所述衬底包括有机光电子部件的至少一个接触焊盘,所述有机光电子部件的至少一个电极是电 连接到所述至少一个接触焊盘,在所述第一层之上或之上形成第二层,以及在所述第一层和所述接触焊盘的至少一个所述衬底的区域中移除至少所述第二层。 第一层物质或物质混合物与基材界面的粘附性小于物质或第二层物质混合物与基材界面的粘附性。