基本信息:
- 专利标题： Hot Melt Adhesive Based On Low Melting Point Polypropylene Homopolymers
- 专利标题（中）：基于低熔点聚丙烯均聚物的热熔胶
- 申请号：US14284381 申请日：2014-05-21
- 公开(公告)号：US20140350155A1 公开(公告)日：2014-11-27
- 发明人： Richard Hamann , Lianne Rachow
- 申请人： Bostik, Inc.
- 申请人地址： US WI Wauwatosa
- 专利权人： Bostik, Inc.
- 当前专利权人： Bostik, Inc.
- 当前专利权人地址： US WI Wauwatosa
- 主分类号： C09J157/02
- IPC分类号： C09J157/02
摘要：
A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has a) about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; b) about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; c) about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; d) about 5% to about 50% of a plasticizer; e) about 1% to about 40% by weight of a secondary polymer which is either a semi-crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; f) about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).
摘要（中）：
一种用于多孔基材的热熔粘合剂，其中该热熔粘合剂具有a）约10％至约70％重量的DSC熔点低于100℃的聚丙烯均聚物; b）约10％至约60％的具有约95℃至约140℃的环球软化点的第一增粘树脂; c）与第一增粘树脂不同的约0％至约65％的第二增粘树脂; d）约5％至约50％的增塑剂; e）约1％至约40％重量的二级聚合物，其为半结晶聚合物或具有大于30焦耳/克的熔解焓的蜡; f）约0.1％至约5％的稳定剂或抗氧化剂; 其中组分总计为组合物重量的100％，组合物的粘度在163℃（325°F）下等于或小于约20,000厘泊（cP）。