基本信息:
- 专利标题： CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）：陶瓷基板及其制造方法
- 申请号：US14133238 申请日：2013-12-18
- 公开(公告)号：US20140166346A1 公开(公告)日：2014-06-19
- 发明人： Yuma OTSUKA , Kazunori FUKUNAGA , Atsushi UCHIDA , Kouhei YOSHIMURA
- 申请人： NGK SPARK PLUG CO., LTD.
- 申请人地址： JP Nagoya
- 专利权人： NGK SPARK PLUG CO., LTD.
- 当前专利权人： NGK SPARK PLUG CO., LTD.
- 当前专利权人地址： JP Nagoya
- 优先权： JP2012-277276 20121219
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K1/03
摘要：
A ceramic substrate is provided that includes a ceramic substrate main body including a principal surface, a connecting terminal portion disposed on the principal surface of the ceramic substrate main body that is capable of being connected to another component via solder, the connecting terminal portion including a copper layer and a coating metal layer covering a surface of the copper layer; a contact layer of titanium or chromium disposed between the ceramic substrate main body and the connecting terminal portion; and an intermediate layer disposed between the copper layer of the connecting terminal portion and the contact layer, the intermediate layer including one of a titanium-tungsten alloy, a nickel-chromium alloy, tungsten, palladium, and molybdenum. The contact layer and the intermediate layer are set back from a side surface of the copper layer in a substrate plane direction.
摘要（中）：
提供一种陶瓷基板，其包括：陶瓷基板主体，其包括主表面;连接端子部，其设置在能够通过焊料与另一部件连接的陶瓷基板主体的主面上;连接端子部， 铜层和覆盖铜层表面的涂层金属层; 设置在陶瓷基板主体和连接端子部之间的钛或铬的接触层; 以及设置在连接端子部分的铜层和接触层之间的中间层，中间层包括钛 - 钨合金，镍 - 铬合金，钨，钯和钼中的一种。 接触层和中间层在基板平面方向上从铜层的侧表面返回。
公开/授权文献:
- US09338897B2 Ceramic substrate, and method of manufacturing the same 公开/授权日：2016-05-10
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |
| ----------H05K1/11 | ..对印刷电路或印刷电路之间提供电连接的印刷元件 |