发明申请
US20130157639A1 MOBILE ELECTRONIC DEVICES UTILIZING RECONFIGURABLE PROCESSING TECHNIQUES TO ENABLE HIGHER SPEED APPLICATIONS WITH LOWERED POWER CONSUMPTION
审中-公开
基本信息:
- 专利标题： MOBILE ELECTRONIC DEVICES UTILIZING RECONFIGURABLE PROCESSING TECHNIQUES TO ENABLE HIGHER SPEED APPLICATIONS WITH LOWERED POWER CONSUMPTION
- 专利标题（中）：移动电子设备利用可重构处理技术实现更低功耗的高速应用
- 申请号：US13365090 申请日：2012-02-02
- 公开(公告)号：US20130157639A1 公开(公告)日：2013-06-20
- 发明人： Jon M. Huppenthal , Thomas R. Seeman , Jeffrey Hammes , D. James Guzy
- 申请人： Jon M. Huppenthal , Thomas R. Seeman , Jeffrey Hammes , D. James Guzy
- 申请人地址： US CO Colorado Springs
- 专利权人： SRC Computers, LLC
- 当前专利权人： SRC Computers, LLC
- 当前专利权人地址： US CO Colorado Springs
- 主分类号： H04W4/00
- IPC分类号： H04W4/00
摘要：
Disclosed herein are mobile electronic devices utilizing reconfigurable processing techniques to enable higher speed applications with lowered power consumption for, inter alia, increased device battery life. The techniques disclosed herein enable greatly enhanced compression/decompression as well as encryption and decryption functionality to be provided in addition to overall greater processing capability particularly in those applications wherein minimization of power consumption is desired. Package-on-package and other assembly techniques may be used to provide the reconfigurable processor in a small footprint package.
摘要（中）：
本文公开了使用可重构处理技术的移动电子设备，以便特别是增加设备电池寿命来实现具有降低的功率消耗的更高速度应用。 除了总体更大的处理能力之外，本文公开的技术能够大大增强压缩/解压缩以及加密和解密功能，特别是在需要最小化功耗的那些应用中。 封装封装和其他装配技术可用于以小尺寸封装提供可重构处理器。