
基本信息:
- 专利标题: METHOD OF TRANSFERRING A LIGHT EMITTING DIODE
- 专利标题(中):传输发光二极管的方法
- 申请号:US13372258 申请日:2012-02-13
- 公开(公告)号:US20130126589A1 公开(公告)日:2013-05-23
- 发明人: Andreas Bibl , John A. Higginson , Hung-Fai Stephen Law , Hsin-Hua Hu
- 申请人: Andreas Bibl , John A. Higginson , Hung-Fai Stephen Law , Hsin-Hua Hu
- 主分类号: B23K31/00
- IPC分类号: B23K31/00 ; B23K37/04
摘要:
A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
摘要(中):
描述了微型发光二极管(LED)和形成用于传送到接收基板的微型LED阵列的方法。 微型LED结构可以包括微型p-n二极管和金属化层,金属化层位于微型p-n二极管和结合层之间。 保形介质阻挡层可以跨越微型p-n二极管的侧壁。 微型LED结构和微型LED阵列可以被拾取并转移到接收衬底。
公开/授权文献:
- US08794501B2 Method of transferring a light emitting diode 公开/授权日:2014-08-05