发明申请
US20130017396A1 ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, FILM FOR BACKSIDE OF FLIP-CHIP SEMICONDUCTOR, AND DICING TAPE-INTEGRATED FILM FOR BACKSIDE OF SEMICONDUCTOR
审中-公开
基本信息:
- 专利标题： ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, FILM FOR BACKSIDE OF FLIP-CHIP SEMICONDUCTOR, AND DICING TAPE-INTEGRATED FILM FOR BACKSIDE OF SEMICONDUCTOR
- 专利标题（中）：用于半导体器件的胶粘膜，用于片状半导体的背面的膜，以及用于半导体背面的带状复合膜
- 申请号：US13547820 申请日：2012-07-12
- 公开(公告)号：US20130017396A1 公开(公告)日：2013-01-17
- 发明人： Goji SHIGA , Naohide TAKAMOTO , Fumiteru ASAI
- 申请人： Goji SHIGA , Naohide TAKAMOTO , Fumiteru ASAI
- 申请人地址： JP Osaka
- 专利权人： NITTO DENKO CORPORATION
- 当前专利权人： NITTO DENKO CORPORATION
- 当前专利权人地址： JP Osaka
- 优先权： JP2011-154827 20110713
- 主分类号： C09J163/00
- IPC分类号： C09J163/00 ; B32B27/38
摘要：
Provided is an adhesive film for a semiconductor device that is capable of having the same physical properties as these at the time of manufacture even after it is stored for a long time. The adhesive film for a semiconductor device of the present invention contains a thermosetting resin, and in which the amount of reaction heat generated in a temperature range of ±80° C. of a reaction heat peak temperature measured by a differential scanning calorimeter after the adhesive film is stored at 25° C. for 4 weeks is 0.8 to 1 time the amount of reaction heat generated before storage.
摘要（中）：
提供一种用于半导体器件的粘合膜，其即使在长时间存储之后也能够具有与制造时相同的物理性质。 本发明的半导体装置用粘合膜含有热固性树脂，其中在粘合剂之后通过差示扫描量热计测量的反应热峰温度在±80℃的温度范围内产生的反应热量 薄膜在25℃下储存4周是储存前产生的反应热量的0.8〜1倍。