![AROMATIC POLYAMIDE FILMS FOR TRANSPARENT FLEXIBLE SUBSTRATES](/abs-image/US/2012/09/27/US20120244330A1/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: AROMATIC POLYAMIDE FILMS FOR TRANSPARENT FLEXIBLE SUBSTRATES
- 专利标题(中):用于透明柔性基材的芳族聚酰胺薄膜
- 申请号:US13172564 申请日:2011-06-29
- 公开(公告)号:US20120244330A1 公开(公告)日:2012-09-27
- 发明人: LIMIN SUN , FRANK W. HARRIS , JIAOKAI JING , HACI B. ERDEM , JOHN D. HARVEY , DONG ZHANG
- 申请人: LIMIN SUN , FRANK W. HARRIS , JIAOKAI JING , HACI B. ERDEM , JOHN D. HARVEY , DONG ZHANG
- 主分类号: B32B27/34
- IPC分类号: B32B27/34 ; B29D7/01 ; B32B7/02
摘要:
The present invention is directed toward transparent films prepared from soluble aromatic copolyamides with glass transition temperatures greater than 300 C. The copolyamides, which contain pendant carboxylic groups are solution cast into films using N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), or other polar solvents. The films are thermally cured at temperatures near the copolymer glass transition temperature. After curing, the polymer films display transmittances>80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. The films are useful as flexible substrates for microelectronic devices.
摘要(中):
本发明涉及由玻璃化转变温度大于300℃的可溶性芳族共聚酰胺制备的透明膜。使用N,N-二甲基乙酰胺(DMAc),N-甲基-2 - 吡咯烷酮(NMP)或其它极性溶剂。 膜在接近共聚物玻璃化转变温度的温度下热固化。 固化后,聚合物膜的透光率从400〜750nm显示> 80%,热膨胀系数小于20ppm,耐溶剂性。 这些膜可用作微电子器件的柔性基板。
公开/授权文献:
IPC结构图谱:
B | 作业;运输 |
--B32 | 层状产品 |
----B32B | 层状产品,即由扁平的或非扁平的薄层,例如泡沫状的、蜂窝状的薄层构成的产品 |
------B32B27/00 | 实质上由合成树脂组成的层状产品 |
--------B32B27/34 | .由聚酰胺组成的 |