基本信息:
- 专利标题： PEELING APPARATUS AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
- 专利标题（中）：半导体器件的剥离装置和制造装置
- 申请号：US13406603 申请日：2012-02-28
- 公开(公告)号：US20120168066A1 公开(公告)日：2012-07-05
- 发明人： Shingo EGUCHI , Yohei MONMA , Atsuhiro TANI , Misako HIROSUE , Kenichi HASHIMOTO , Yasuharu HOSAKA
- 申请人： Shingo EGUCHI , Yohei MONMA , Atsuhiro TANI , Misako HIROSUE , Kenichi HASHIMOTO , Yasuharu HOSAKA
- 申请人地址： JP Atsugi-shi
- 专利权人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人地址： JP Atsugi-shi
- 优先权： JP2006-266531 20060929
- 主分类号： B32B38/10
- IPC分类号： B32B38/10
摘要：
To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.
摘要（中）：
为了在从用于制造半导体元件的基板剥离包含半导体元件的元件形成层而被除去形成有元件形成层和剥离层的基板和薄膜之间的间隙中时，为了消除放电， 加压辊。 该膜附着在加压辊之间的元件形成层上，加压辊的一侧的加压辊的弯曲表面沿加压辊的弯曲表面弯曲并收集。 在元件形成层和剥离层之间产生剥离，并且元件形成层被转印到膜上。 通过喷嘴将液体顺序地供给到通过剥离产生的元件形成层和剥离层之间的间隙，使得在元件形成层和剥离层的表面上产生的电荷被液体扩散。
公开/授权文献:
IPC结构图谱:
| B | 作业；运输 |
| --B32 | 层状产品 |
| ----B32B | 层状产品，即由扁平的或非扁平的薄层，例如泡沫状的、蜂窝状的薄层构成的产品 |
| ------B32B38/00 | 与层压方法有关的辅助操作 |
| --------B32B38/10 | .用机械或化学方法除去层或层的一部分 |