
基本信息:
- 专利标题: LIGHT EMITTING DEVICE
- 专利标题(中):发光装置
- 申请号:US12944908 申请日:2010-11-12
- 公开(公告)号:US20110057553A1 公开(公告)日:2011-03-10
- 发明人: Satoru OGAWA
- 申请人: Satoru OGAWA
- 优先权: JP2004-344484 20041129
- 主分类号: H01K1/30
- IPC分类号: H01K1/30 ; H01J5/00
摘要:
A light emitting device having excellent thermal resistance and light resistance is provided. The light emitting device is manufactured by disposing a substrate electrode having a predetermined conductive pattern provided thereon to a substrate of a ceramic; flip-chip mounting a light emitting element having an n-side electrode and a p-side electrode on a common surface side onto the substrate electrode in a face-down manner and electrically connecting thereto; heating a glass to a temperature from the glass transition temperature to below the melting point of the glass, until the glass shows its softened state; and fixing the softened glass to the substrate by way of pressing to cover the light emitting element with the glass.
摘要(中):
提供了具有优异的耐热性和耐光性的发光器件。 通过将其上设置有预定导电图案的基板电极设置在陶瓷的基板上来制造发光器件; 将在公共表面侧具有n侧电极和p侧电极的发光元件以面向下方式安装在基板电极上并与其电连接的倒装芯片; 将玻璃加热至玻璃化转变温度至玻璃熔点以下,直至玻璃呈软化状态; 并通过压制将软化的玻璃固定到基板上,以用玻璃覆盖发光元件。
公开/授权文献:
- US08531105B2 Light emitting device 公开/授权日:2013-09-10