基本信息:
- 专利标题： MOULDING WITH EMBEDDED LIGHTING
- 专利标题（中）：用嵌入式照明模制
- 申请号：US12634230 申请日：2009-12-09
- 公开(公告)号：US20110037411A1 公开(公告)日：2011-02-17
- 发明人： Norik BONYADI
- 申请人： Norik BONYADI
- 优先权： CA2675390 20090813
- 主分类号： H05B37/02
- IPC分类号： H05B37/02 ; F21S8/00 ; H01J9/24
摘要：
A decorative moulding having embedded lighting that is directly visible through a hole in the moulding when viewed from a front surface of the moulding, and a method of making a modular moulding having embedded lighting. The lighting is provided by a light source, preferably a light emitting diode, that is positioned in a light mount. The light mount is fixed to the substrate with the light source in the hole in the moulding. A plurality of light mounts can be positioned in a respective plurality of holes in the substrate at desired spacings with light mounts connected to each adjacent light mount by electrically conductive wires. The decorative moulding can be manufactured as modular pieces and the electrically conductive wires can be connected to wires of adjacent modular pieces.
摘要（中）：
具有嵌入式照明的装饰性模制品，以及从模制品的前表面观察时通过模制件中的孔直接可见的嵌入式照明装置以及具有嵌入式照明的模块化模制方法。 照明由位于光安装座中的光源（优选为发光二极管）提供。 灯座固定在基板上，光源位于模制件的孔中。 可以以期望的间隔将多个光安装座定位在基板中的相应多个孔中，其中光安装件通过导电线连接到每个相邻的光安装座。 装饰成型品可以制造为模块件，并且导电线可以连接到相邻模块件的导线。
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05B | 电热；其他类目不包含的电照明 |
| ------H05B37/00 | 用于一般电光源的电路装置 |
| --------H05B37/02 | .控制 |