![BUFFER STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION](/abs-image/US/2010/07/01/US20100163848A1/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: BUFFER STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION
- 专利标题(中):半导体器件的缓冲结构和制造方法
- 申请号:US12347883 申请日:2008-12-31
- 公开(公告)号:US20100163848A1 公开(公告)日:2010-07-01
- 发明人: Prashant Majhi , Jack Kavalieros , Wilman Tsai
- 申请人: Prashant Majhi , Jack Kavalieros , Wilman Tsai
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/165 ; H01L21/20
摘要:
Embodiments of the present invention describe a semiconductor device having an buffer structure and methods of fabricating the buffer structure. The buffer structure is formed between a substrate and a quantum well layer to prevent defects in the substrate and quantum well layer due to lattice mismatch. The buffer structure comprises a first buffer layer formed on the substrate, a plurality of blocking members formed on the first buffer layer, and second buffer formed on the plurality of blocking members. The plurality of blocking members prevent the second buffer layer from being deposited directly onto the entire first buffer layer so as to minimize lattice mismatch and prevent defects in the first and second buffer layers.
摘要(中):
本发明的实施例描述了具有缓冲结构的半导体器件和制造缓冲结构的方法。 缓冲结构形成在衬底和量子阱层之间,以防止由于晶格失配而引起的衬底和量子阱层中的缺陷。 缓冲结构包括形成在基板上的第一缓冲层,形成在第一缓冲层上的多个阻挡构件和形成在多个阻挡构件上的第二缓冲器。 多个阻挡构件防止第二缓冲层直接沉积在整个第一缓冲层上,以便最小化晶格失配并防止第一和第二缓冲层中的缺陷。