发明申请
US20100148354A1 INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING THROUGH SILICON VIA WITH DIRECT INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF
有权
基本信息:
- 专利标题： INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING THROUGH SILICON VIA WITH DIRECT INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）：具有直接互连通过硅的集成电路包装系统及其制造方法
- 申请号：US12333297 申请日：2008-12-11
- 公开(公告)号：US20100148354A1 公开(公告)日：2010-06-17
- 发明人： A Leam Choi , Jae Han Chung , DeokKyung Yang , HyungSang Park
- 申请人： A Leam Choi , Jae Han Chung , DeokKyung Yang , HyungSang Park
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L21/62
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a through silicon via die having an interconnect through a silicon substrate; depositing a re-distribution layer on the through silicon via die and connected to the interconnects; mounting a structure over the through silicon via die; connecting the structure to the interconnect of the through silicon via die with a direct interconnect; and encapsulating the through silicon via die and partially encapsulating the structure with an encapsulation.
摘要（中）：
一种制造集成电路封装系统的方法，包括：提供具有通过硅衬底的互连的通孔芯片; 通过管芯沉积在穿硅上的再分布层并连接到互连; 通过模具将结构安装在贯穿硅上; 通过芯片将直接互连的结构连接到通孔的互连件; 并通过管芯封装穿硅，并用封装部分地封装结构。
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/02 | .容器；封接 |
| ----------H01L23/31 | ..按配置特点进行区分的 |