发明申请
US20100083500A1 LEVELING METHOD FOR BURYING EVAPORATING SECTION OF HEAT PIPE INTO THERMALLY CONDUCTIVE SEAT
有权
基本信息:
- 专利标题： LEVELING METHOD FOR BURYING EVAPORATING SECTION OF HEAT PIPE INTO THERMALLY CONDUCTIVE SEAT
- 专利标题（中）：将热管蒸发蒸发到热导阀座的水平方法
- 申请号：US12477471 申请日：2009-06-03
- 公开(公告)号：US20100083500A1 公开(公告)日：2010-04-08
- 发明人： Kuo-Len LIN , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
- 申请人： Kuo-Len LIN , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
- 优先权： TW097138229 20081003
- 主分类号： B21D53/02
- IPC分类号： B21D53/02
摘要：
A leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat is provided for an assembly of heat pipe and heat-conducting seat by simultaneously making the evaporating section of heat pipe partially formed into a flat surface when the evaporating section of heat pipe is being burying into the thermally conductive seat. Furthermore, in cooperation with a stamping machine, the leveling method is to make a multiple steps of press-fitting process to an evaporating section of heat pipe under a condition that there is no need to change the stamping die.
摘要（中）：
提供一种用于将热管的蒸发部分埋入导热座中的调平方法，用于通过将热管的蒸发部分形成为平坦表面的同时使热管和导热座的蒸发部分形成为平坦表面， 热管正在埋入导热座中。 此外，与冲压机配合使用，调平方法是在不需要改变冲压模具的条件下，对热管的蒸发部进行多次压配。
公开/授权文献:
IPC结构图谱:
| B | 作业；运输 |
| --B21 | 基本上无切削的金属机械加工；金属冲压 |
| ----B21D | 金属板或管、棒或型材的基本无切削加工或处理；冲压 |
| ------B21D53/00 | 其他特种制品的制造 |
| --------B21D53/02 | .热交换器，如散热器、冷凝器 |