发明申请
US20090227064A1 X-Y ADDRESS TYPE SOLID STATE IMAGE PICKUP DEVICE AND METHOD OF PRODUCING THE SAME
有权
基本信息:
- 专利标题： X-Y ADDRESS TYPE SOLID STATE IMAGE PICKUP DEVICE AND METHOD OF PRODUCING THE SAME
- 专利标题（中）：X-Y地址型固态摄像装置及其制造方法
- 申请号：US12468692 申请日：2009-05-19
- 公开(公告)号：US20090227064A1 公开(公告)日：2009-09-10
- 发明人： Ryoji Suzuki , Keiji Mabuchi , Tomonori Mori
- 申请人： Ryoji Suzuki , Keiji Mabuchi , Tomonori Mori
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2001-210270 20010711
- 主分类号： H01L31/0224
- IPC分类号： H01L31/0224 ; H01L23/544 ; H01L21/304
摘要：
In an X-Y address type solid state image pickup device represented by a CMOS image sensor, a back side light reception type pixel structure is adopted in which a wiring layer is provided on one side of a silicon layer including photo-diodes formed therein, and visible light is taken in from the other side of the silicon layer, namely, from the side (back side) opposite to the wiring layer. Wiring can be made without taking a light-receiving surface into account, and the degree of freedom in wiring for the pixels is enhanced.
摘要（中）：
在由CMOS图像传感器表示的XY地址型固体摄像装置中，采用背面光接收型像素结构，其中布线层设置在其中形成有光电二极管的硅层的一侧，并且可见 从硅层的另一侧，即从与布线层相对的一侧（背面）吸入光。 可以在不考虑光接收表面的情况下进行布线，并且增强像素的布线自由度。