发明申请
US20080222876A1 SYSTEM FOR ATTACHING ELECTRONIC COMPONENTS TO MOLDED INTERCONNECTION DEVICES
有权
基本信息:
- 专利标题： SYSTEM FOR ATTACHING ELECTRONIC COMPONENTS TO MOLDED INTERCONNECTION DEVICES
- 专利标题（中）：将电子元件连接到成型互连器件的系统
- 申请号：US11684665 申请日：2007-03-12
- 公开(公告)号：US20080222876A1 公开(公告)日：2008-09-18
- 发明人： Ronald M. Weber , Sheldon Lynn Horst
- 申请人： Ronald M. Weber , Sheldon Lynn Horst
- 申请人地址： US PA Middletown
- 专利权人： TYCO ELECTRONICS CORPORATION
- 当前专利权人： TYCO ELECTRONICS CORPORATION
- 当前专利权人地址： US PA Middletown
- 主分类号： H01L23/58
- IPC分类号： H01L23/58 ; H01S4/00
摘要：
A system for connecting electrical devices to one another is provided. This system includes a horizontal or non-horizontal substrate and an anchor connected to or formed integrally with the substrate. The anchor is either a raised structure or a recessed structure, and further includes at least one retention member formed integrally with the anchor. At least one electronic component is mounted within the anchor and the at least one retention member secures the component to the substrate. At least one electrical trace is disposed on the substrate and the at least one electrical trace extends into the anchor, contacts the at least one electronic component, and forms an electrical connection between the substrate and the at least one electronic component.
摘要（中）：
提供了一种用于将电气设备彼此连接的系统。 该系统包括水平或非水平衬底和连接到衬底或与衬底一体形成的锚固件。 锚固件是凸起结构或凹形结构，并且还包括与锚固件一体形成的至少一个保持构件。 至少一个电子部件安装在锚固体内，并且至少一个保持构件将部件固定到基底上。 至少一个电迹线设置在衬底上，并且至少一个电迹线延伸到锚中，接触至少一个电子部件，并在衬底和至少一个电子部件之间形成电连接。
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/58 | .其他组不包含的，用于半导体器件的电结构装置 |