发明申请
US20080179647A1 SEMICONDUCTOR DEVICE COMPRISING A BARRIER INSULATING LAYER AND RELATED METHOD
审中-公开

基本信息:
- 专利标题: SEMICONDUCTOR DEVICE COMPRISING A BARRIER INSULATING LAYER AND RELATED METHOD
- 专利标题(中):包含障壁绝缘层的半导体器件及相关方法
- 申请号:US11964146 申请日:2007-12-26
- 公开(公告)号:US20080179647A1 公开(公告)日:2008-07-31
- 发明人: Hyeoung-won Seo , Dong-hyun Kim , Kang-yoon Lee , Seong-goo Kim
- 申请人: Hyeoung-won Seo , Dong-hyun Kim , Kang-yoon Lee , Seong-goo Kim
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2007-0008611 20070126
- 主分类号: H01L27/108
- IPC分类号: H01L27/108 ; H01L21/8239
摘要:
A semiconductor device comprising a barrier insulating layer and a related method of fabrication is disclosed. The semiconductor device semiconductor substrate includes a plurality of active regions, wherein active regions are defined by a device isolation layer and are disposed along a first direction; a plurality of bit line electrodes connected to the active regions, wherein each of the bit line electrodes extends along a second direction; and a plurality of first barrier insulating layers. Each of the first barrier insulating layers extends along a third direction, at least one of the first barrier insulating layers is disposed on a corresponding first portion of the device isolation layer disposed between two of the active regions, the two of the active regions are adjacent along the first direction, and the first direction and the second direction differ from one another.
摘要(中):
公开了一种包括阻挡绝缘层和相关制造方法的半导体器件。 半导体器件半导体衬底包括多个有源区,其中有源区由器件隔离层限定,并沿着第一方向设置; 连接到有源区的多个位线电极,其中每个位线电极沿着第二方向延伸; 以及多个第一阻挡绝缘层。 每个第一阻挡绝缘层沿着第三方向延伸,至少一个第一阻挡绝缘层设置在设置在两个有源区之间的器件隔离层的对应的第一部分上,两个有源区相邻 沿第一方向,第一方向和第二方向彼此不同。
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L27/00 | 由在一个共用衬底内或其上形成的多个半导体或其他固态组件组成的器件 |
--------H01L27/02 | .包括有专门适用于整流、振荡、放大或切换的半导体组件并且至少有一个电位跃变势垒或者表面势垒的;包括至少有一个跃变势垒或者表面势垒的无源集成电路单元的 |
----------H01L27/04 | ..其衬底为半导体的 |
------------H01L27/06 | ...在非重复结构中包括有多个单个组件的 |
--------------H01L27/105 | ....包含场效应组件的 |
----------------H01L27/108 | .....动态随机存取存储结构的 |