发明申请
US20080157395A1 INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING IMPROVED REACTION BARRIER LAYERS
有权
基本信息:
- 专利标题： INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING IMPROVED REACTION BARRIER LAYERS
- 专利标题（中）：使用无铅焊盘和改进的反应障碍层进行片芯互连
- 申请号：US11616919 申请日：2006-12-28
- 公开(公告)号：US20080157395A1 公开(公告)日：2008-07-03
- 发明人： Luc Belanger , Stephen L. Buchwalter , Leena Paivikki Buchwalter , Ajay P. Giri , Jonathan H. Griffith , Donald W. Henderson , Sung Kwon Kang , Eric H. Laine , Christian Lavoie , Paul A. Lauro , Valerie Anne Oberson , Da-Yuan Shih , Kamalesh K. Srivastava , Michael J. Sullivan
- 申请人： Luc Belanger , Stephen L. Buchwalter , Leena Paivikki Buchwalter , Ajay P. Giri , Jonathan H. Griffith , Donald W. Henderson , Sung Kwon Kang , Eric H. Laine , Christian Lavoie , Paul A. Lauro , Valerie Anne Oberson , Da-Yuan Shih , Kamalesh K. Srivastava , Michael J. Sullivan
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/44
摘要：
An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.
摘要（中）：
一种适于将微电子器件芯片倒装连接到封装的互连结构，包括二层，三层或四层限流冶金，包括粘附/反应阻挡层，并且具有与含锡的组分反应的焊料可湿性层 无铅焊料，使得可焊接层在焊接期间可以完全消耗，但在焊接期间与无铅焊料接触后，阻挡层保持不变。 一个或多个无铅焊料球选择性地位于焊料润湿层上，该无铅焊球包含锡作为主要成分和一种或多种合金成分。
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/48 | .用于向或自处于工作中的固态物体通电的装置，例如引线、接线端装置 |