发明申请
US20080042279A1 MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE HAVING FLUX AND UNDER FILL RESIN LAYER AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE
审中-公开
基本信息:
- 专利标题： MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE HAVING FLUX AND UNDER FILL RESIN LAYER AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE
- 专利标题（中）：具有通孔和填充树脂层的半导体器件的安装结构以及安装半导体器件的方法
- 申请号：US11842858 申请日：2007-08-21
- 公开(公告)号：US20080042279A1 公开(公告)日：2008-02-21
- 发明人： Hyo-Jae BANG , Wha-Su SIN , Sung-Yeol LEE , Yung-Hyun KIM , Seong-Chan HAN , Jung-Hyeon KIM
- 申请人： Hyo-Jae BANG , Wha-Su SIN , Sung-Yeol LEE , Yung-Hyun KIM , Seong-Chan HAN , Jung-Hyeon KIM
- 申请人地址： KR Gyeonggi-do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Gyeonggi-do
- 优先权： KR2006-0078917 20060821
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/60 ; H01L21/66
摘要：
A mounting structure of a semiconductor device and a method of mounting the semiconductor device are provided. The mounting structure includes a circuit substrate having a terminal pad. A device substrate is located over the circuit substrate having a ball pad facing the terminal pad of the circuit substrate. A conductive ball is formed between the circuit substrate and the device substrate in order to connect the terminal pad of the circuit substrate to the ball pad of the device substrate. A first soldering flux including an epoxy-based resin connects the conductive ball to the ball pad of the device substrate. An underfill layer is formed between the circuit substrate and the device substrate in order to bury the conductive ball and the first soldering flux. Using the epoxy-based resin, the first soldering flux can substantially prevent crack from being generated in a solder joint between the conductive ball and the ball pad even when the device substrate is thermally deformed due to temperature variations.
摘要（中）：
提供半导体器件的安装结构和安装半导体器件的方法。 安装结构包括具有终端焊盘的电路基板。 器件衬底位于电路衬底上方，该衬底具有面向电路衬底的端子焊盘的球垫。 在电路基板和器件基板之间形成导电球，以将电路基板的端子焊盘连接到器件基板的球垫。 包括环氧基树脂的第一助焊剂将导电球连接到器件基板的球垫。 在电路基板和器件基板之间形成底部填充层，以便埋入导电球和第一焊剂。 使用环氧树脂，即使当器件基板由于温度变化而发生热变形时，第一焊剂可以基本上防止在导电球和球垫之间的焊接接头中产生裂纹。
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/34 | .冷却装置；加热装置；通风装置或温度补偿装置 |
| ----------H01L23/488 | ..由焊接或黏结结构组成 |