
基本信息:
- 专利标题: Cleaning Solution and Cleaning Method of a Semiconductor Device
- 专利标题(中):半导体器件的清洁方案和清洁方法
- 申请号:US11736260 申请日:2007-04-17
- 公开(公告)号:US20070181150A1 公开(公告)日:2007-08-09
- 发明人: Sang-Yong KIM , Sang-Jun Choi , Chang-Ki Hong
- 申请人: Sang-Yong KIM , Sang-Jun Choi , Chang-Ki Hong
- 优先权: KR2003-36090 20030604
- 主分类号: C23G1/00
- IPC分类号: C23G1/00 ; B08B7/00 ; B08B3/00
摘要:
A cleaning method for removing foreign bodies during the fabrication of semiconductor devices including treating a substrate with a cleaning solution including an oxidizer to form a chemical oxide layer and then removing the chemical oxide layer, thereby removing foreign bodies from a surface of the semiconductor substrate. Accordingly, the foreign bodies can be substantially removed from the surface of the substrate without corroding a metal.
摘要(中):
一种用于在制造半导体器件期间去除异物的清洁方法,包括用包括氧化剂的清洁溶液处理基底以形成化学氧化物层,然后除去化学氧化物层,从而从半导体衬底的表面去除异物。 因此,异物可以基本上从基板的表面除去而不会腐蚀金属。