基本信息:
- 专利标题： Wire bonds having pressure-absorbing balls
- 专利标题（中）：带有压力吸收球的线接头
- 申请号：US11026840 申请日：2004-12-30
- 公开(公告)号：US20060144907A1 公开(公告)日：2006-07-06
- 发明人： Sohichi Kadoguchi , Norihiro Kawakami
- 申请人： Sohichi Kadoguchi , Norihiro Kawakami
- 主分类号： B23K31/02
- IPC分类号： B23K31/02
摘要：
A semiconductor device with a chip having at least one metallic bond pad (101) over weak insulating material (102). In contact with this bond pad is a flattened metal ball (104) made of at least 99.999 % pure metal such as gold, copper, or silver. The diameter (104a) of the flattened ball is less than or equal to the diameter (103a) of the bond pad. A wire (110) is connected to the bond pad so that the wire has a thickened portion (111) conductively attached to the flattened metal ball. The wire is preferably made of composed metal such as gold alloy. The composition of the flattened ball is softer than the wire. This softness of the flattened ball protects the underlying insulator against damage caused by pressure or stress, when the composed ball is attached.
摘要（中）：
一种具有在弱绝缘材料（102）上具有至少一个金属接合焊盘（101）的芯片的半导体器件。 与该接合垫接触的是由金，铜或银等至少99.999％的纯金属制成的扁平金属球（104）。 扁平球的直径（104a）小于或等于接合垫的直径（103a）。 线（110）连接到接合焊盘，使得导线具有导电地附接到扁平金属球的加厚部分（111）。 电线优选由金合金等组成金属制成。 扁平球的组成比线更软。 扁平球的柔软度保护下层绝缘体免受压力或应力造成的损伤，当组合球被附着时。
公开/授权文献:
- US07404513B2 Wire bonds having pressure-absorbing balls 公开/授权日：2008-07-29