发明申请
US20040155089A1 Recognition device, bonding device, and method of manufacturing a circuit device
有权
基本信息:
- 专利标题： Recognition device, bonding device, and method of manufacturing a circuit device
- 申请号：US10770027 申请日：2004-02-02
- 公开(公告)号：US20040155089A1 公开(公告)日：2004-08-12
- 发明人： Kouji Seki , Noriyasu Sakai , Toshihiko Higashino
- 申请人： Sanyo Electric Co., Ltd., a Japan corporation
- 申请人地址： null
- 专利权人： Sanyo Electric Co., Ltd., a Japan corporation
- 当前专利权人： Sanyo Electric Co., Ltd., a Japan corporation
- 当前专利权人地址： null
- 优先权： JPP.2001-195397 20010627
- 主分类号： B23K037/00
- IPC分类号： B23K037/00
摘要：
The present invention solves a problem that in a wire bonding process, an inert gas used for prevention of oxidation of a substrate gave rise to shimmer due to the temperature difference during bonding, thereby degrading the precision of pattern recognition. With this invention's bonding device 21, shielding lids 31, 32, and 33 are disposed at upper and lower parts of a ring illumination 25 and at a lower part of lens barrel 29. Shimmer 37 of nitrogen gas that blows out from a working hole 24 can thus be prevented from entering inside ring illumination 25, especially by shielding lid 31 at the lower part of ring illumination 25. As a result, the recognition precision of a recognition camera can be improved and the wire bonding precision of the nullm order can be improved.