基本信息:
- 专利标题： Panel molded electronic assemblies with multi-surface conductive contacts
- 申请号：US17582734 申请日：2022-01-24
- 公开(公告)号：US12096549B1 公开(公告)日：2024-09-17
- 发明人： Patrizio Vinciarelli , Patrick R. Lavery , Rudolph F. Mutter , Jeffery J. Kirk , Andrew T. D'Amico
- 申请人： Vicor Corporation
- 申请人地址： US MA Andover
- 专利权人： Vicor Corporation
- 当前专利权人： Vicor Corporation
- 当前专利权人地址： US MA Andover
- 代理机构： Fish & Richardson P.C.
- 分案原申请号： US15969882 2018.05.03
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H01L23/053 ; H01L23/057 ; H01L23/28 ; H05K1/11 ; H05K1/18 ; H05K3/00 ; H05K3/16 ; H05K3/18 ; H05K3/20 ; H05K3/24 ; H05K3/38 ; H01L21/44 ; H01L23/14
摘要：
Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |