An electronic carrier board and a package structure thereof are provided. The electronic carrier board includes a main body, a plurality of bond pads provided in pairs on a surface of the main body, and a protective layer for covering the surface of the main body. The protective layer is formed with an opening at a position between at least two paired bond pads to expose at least three side surfaces of each of the bond pads. Furthermore, the protective layer is formed with at least one independent residual portion in the opening between the two paired bond pads to allow an electronic device to be mounted on the independent residual portion of the protective layer. Thus, when the electronic device is electrically connected to the paired bond pads by an electrically conductive material, a flowing space without a dead space can be formed between the electronic device and the surface of the main body. Thereby, during encapsulating the electronic device, an insulating resin can be fully distributed at a bottom side of the electronic device and in the opening to cover the at least three side surfaces of each of the bond pads, so as to prevent voids from being generated at the bottom side of the electronic device and prevent the electrically conductive material from having undesirable electrical bridging between the paired bond pads or adjacent electronic devices.