The present invention discloses an electronic devices including a wiring substrate and an electronic component which is mounted on the wiring substrate via soldering, and a case fixed to the wiring substrate to cover the electronic component, so as to improve the strength for fixing the case to the wiring substrate. In addition to fixing the case 12 onto the wiring substrate 2 by the soldering material 18, the adhesive resin 20 is introduced into the hole 21 on the top wall 13 of the case 12. The electronic device 6 mounted on the wiring substrate 2 is adhered to the case 12 mutually by the adhesive resin 20. The adhesive resin 20 does not contact the wiring substrate 2. Therefore, even if the soldering material 10 to mount the electronic device 6 expands due to melting in the soldering process, the adhesive resin 20 and wiring substrate 2 won't peel off at the interface. Therefore, the short-circuit between the terminal electrode of the electronic device 6 due the flowing of soldering material 10 along the peeled portion of interface is not prone to occur.