基本信息:
- 专利标题: 高分子化合物及增强化學性之正型光阻材料
- 专利标题(英):Polymers and chemically amplified positive resist compositions
- 专利标题(中):高分子化合物及增强化学性之正型光阻材料
- 申请号:TW087100572 申请日:1998-01-16
- 公开(公告)号:TW528932B 公开(公告)日:2003-04-21
- 发明人: 本海清 , 渡邊修 , 渡邊聰 , 名倉茂 , 石原俊信
- 申请人: 信越化學工業股份有限公司
- 申请人地址: 日本
- 专利权人: 信越化學工業股份有限公司
- 当前专利权人: 信越化學工業股份有限公司
- 当前专利权人地址: 日本
- 代理人: 林志剛
- 优先权: 日本 26026 19970124
- 主分类号: G03F
- IPC分类号: G03F
A polymer comprising recurring units of formula (1) is provided in which some hydrogen atoms of phenolic hydroxyl groups and/or carboxyl groups are replaced by acid labile groups. The polymer is crosslinked with a crosslinking group having a C-O-C linkage resulting from reaction of some of the remaining phenolic hydroxyl groups and/or carboxyl groups with an alkenyl ether compound or halogenated alkyl ether compound. The amount of the acid labile group and the crosslinking group combined is on the average from more than 0 mol % to 80 mol % of the entirety of the phenolic hydroxyl group and carboxyl group. The polymer has Mw of 1,000-500,000 (R1 is H or methyl, R2 is C1-C8 alkyl, R3 is H, R4 is -COOR5 (R5 is C1-C5 alkyl or phenyl), or R3 and R4, taken together, may form -COOCO-). X is zero or positive integers, and y is positive integers. X and y satisfy x+y ≤ 5, p and q are positive numbers satisfying p+q=1 and 0 < q/(p+q) ≤ 0.9. A chemically amplified positive resist composition comprising the polymer as a base resin has high sensitivity and resolution and forms resist patterns having plasma etching resistance, heat resistance, overhang prevention, and dimensional controllability.