基本信息:
- 专利标题： 多層電路板及其製造方法
- 专利标题（英）：Multilayer circuit board and method of manufacturing the same
- 专利标题（中）：多层电路板及其制造方法
- 申请号：TW090128064 申请日：2001-11-13
- 公开(公告)号：TW507514B 公开(公告)日：2002-10-21
- 发明人： 內野野良幸 , 澤田 和男 , 正木 康史 , 武藤 正英
- 申请人： 松下電工股份有限公司
- 申请人地址： 日本
- 专利权人： 松下電工股份有限公司
- 当前专利权人： 松下電工股份有限公司
- 当前专利权人地址： 日本
- 代理人： 詹銘文; 蕭錫清
- 优先权： 日本 2000-360220 20001127 日本 2000-367091 20001201
- 主分类号： H05K
- IPC分类号： H05K
A molded interconnect device (MID) having a multilayer circuit of a reduced thickness, in which a layer-to-layer connection(s) is formed with high reliability, is provided as a multilayer circuit board.The multilayer circuit board comprises a substrate having a first surface and a second surface extending from an end of the first surface at a required angle relative to the first surface, and the multilayer circuit formed on the first surface and composed of a plurality of circuit layers. Each of the circuit layers is provided with a conductive layer having a required circuit pattern and an insulation layer formed on the conductive layer by film formation. The layer-to-layer connection of the multilayer circuit is made through a second conductive layer formed on the second surface of the substrate.
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |