The present application provides a film-shaped calcination material 1 including a sintering metallic particle 10 and a binder component 20, wherein the amount of the sintering metallic particle 10 is 15 to 98 % by mass, the amount of the binder component 20 is 2 to 50 % by mass, the tension elastic modulus at 60 DEG C is 4.0 to 10.0 MPa, and the breaking elongation at 60 DEG C is 500% or more; a film-shaped calcination material with a supporting sheet comprising a film-shaped calcination material 1 including a sintering metallic particle and a binder component and a supporting sheet 2 that is provided at least one side of the film-shaped calcination material, wherein the adhesive of the film-shaped calcination material with respect to the supporting sheet (a2) is less than the adhesive of the film-shaped calcination material with respect to a semiconductor wafer (a1), and the adhesive (a1) is 0.1N/25 mm or more and the adhesive (a2) is 0.1N/25 mm or more and 0.5N/25 mm or less.