基本信息:
- 专利标题: 基板處理裝置
- 专利标题(英):Substrate processing apparatus
- 专利标题(中):基板处理设备
- 申请号:TW106104442 申请日:2017-02-10
- 公开(公告)号:TW201740488A 公开(公告)日:2017-11-16
- 发明人: 橋本光治 , HASHIMOTO, KOJI
- 申请人: 斯庫林集團股份有限公司 , SCREEN HOLDINGS CO., LTD.
- 专利权人: 斯庫林集團股份有限公司,SCREEN HOLDINGS CO., LTD.
- 当前专利权人: 斯庫林集團股份有限公司,SCREEN HOLDINGS CO., LTD.
- 代理人: 陳家輝
- 优先权: 2016-024955 20160212
- 主分类号: H01L21/67
- IPC分类号: H01L21/67 ; B05C11/00
A substrate processing apparatus includes a chamber, a substrate holding unit, an elevated/lowered member, and an elevation/lowering driving unit. The chamber includes a base plate having an upper surface that defines a housing space. The substrate holding unit is housed in the housing space, is placed on the upper surface of the base plate, and holds a substrate. The elevated/lowered member is elevated and lowered inside the housing space. The elevation/lowering driving unit drives the elevation and lowering of the elevated/lowered member. The elevation/lowering driving unit includes a driving source, disposed higher than a lower surface of the base plate, and an elevating/lowering head, which is connected to a guard and is moved vertically by the driving source within a movable range in which an entirety of the head is positioned higher than the lower surface of the base plate.
公开/授权文献:
- TWI684228B 基板處理裝置 公开/授权日:2020-02-01
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置;专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |