基本信息:
- 专利标题： 晶圓級堆疊晶片封裝及製造其之方法
- 专利标题（英）：Wafer-level stack chip package and method of manufacturing the same
- 专利标题（中）：晶圆级堆栈芯片封装及制造其之方法
- 申请号：TW106105924 申请日：2015-11-05
- 公开(公告)号：TW201733075A 公开(公告)日：2017-09-16
- 发明人： 高永範 , KO, YEONG BEOM , 金東進 , KIM, DONG JIN , 茶水旺 , CHA, SE WOONG
- 申请人： 艾馬克科技公司 , AMKOR TECHNOLOGY, INC.
- 专利权人： 艾馬克科技公司,AMKOR TECHNOLOGY, INC.
- 当前专利权人： 艾馬克科技公司,AMKOR TECHNOLOGY, INC.
- 代理人： 閻啟泰; 林景郁
- 优先权： 10-2014-0152687 20141105;14/931,112 20151103
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L21/78 ; H01L23/31 ; H01L23/00 ; H01L21/56 ; H01L25/00
A semiconductor product in the form of a stack chip package and a method of manufacturing the same, where a plurality of semiconductor chips are stacked one on another so as to enable the exchange of electrical signals between the semiconductor chips, and where a conductive layer is included for inputting and outputting signals to and from individual Chips. A stack chip package having a compact size may, for example, be manufactured by stacking, on a first semiconductor chip, a second semiconductor chip having a smaller surface area by means of interconnection structures so as to enable the exchange of electrical signals between the first and second semiconductor chips, and by using a conductive layer for inputting and outputting signals to and from individual semiconductor chips, in lieu of a thick substrate. Furthermore, heat dissipation effects can be enhanced by the addition of a heat dissipation unit.
公开/授权文献:
- TWI686918B 晶圓級堆疊晶片封裝及製造其之方法 公开/授权日：2020-03-01
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L25/00 | 由多个单个半导体或其他固态器件组成的组装件 |
| --------H01L25/03 | .所有包含在H01L27/00至H01L51/00各组中同一小组内的相同类型的器件，例如整流二极管的组装件 |
| ----------H01L25/04 | ..不具有单独容器的器件 |
| ------------H01L25/065 | ...包含在H01L27/00组类型的器件 |