基本信息:
- 专利标题： 多層撓性印刷配線板及其製造方法
- 专利标题（英）：Multilayer flexible printed wiring board and method for producing same
- 专利标题（中）：多层挠性印刷配线板及其制造方法
- 申请号：TW105125001 申请日：2016-08-05
- 公开(公告)号：TW201720241A 公开(公告)日：2017-06-01
- 发明人： 豊島良一 , TOYOSHIMA, RYOICHI
- 申请人： 日本美可多龍股份有限公司 , NIPPON MEKTRON, LTD.
- 专利权人： 日本美可多龍股份有限公司,NIPPON MEKTRON, LTD.
- 当前专利权人： 日本美可多龍股份有限公司,NIPPON MEKTRON, LTD.
- 代理人： 林志剛
- 优先权： 2015-156168 20150806
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K3/46
To provide a multilayer flexible printed wiring board having a stripline which is advantageous for bending. A multilayer flexible printed wiring board 100 according to an embodiment having a stripline which can be bent at a bending part F1 is provided with: a flexible insulating substrate 30; an inner-layer circuit pattern 5 provided inside the flexible insulating substrate 30 and including a signal line 6 extending in a predetermined direction; a ground thin film 14a forming at least a ground layer at the bending portion F1 in a ground layer of the stripline, and including an electroless plating film 14 formed on the flexible insulating substrate 30; and a protective layer 20 covering the ground thin film 14a and firmly attached to an exposed section 19 where the flexible insulating substrate 30 is exposed.
公开/授权文献:
- TWI665943B 多層撓性印刷配線板及其製造方法 公开/授权日：2019-07-11
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |