基本信息:
- 专利标题： 利用具有摩擦增強圖案的周邊表面在濕式化學製程期間接觸基板的壓模製品
- 专利标题（英）：Compression molded articles employing circumferential surfaces having friction-enhancing patterns to contact substrates during wet chemical processes
- 专利标题（中）：利用具有摩擦增强图案的周边表面在湿式化学制程期间接触基板的压模制品
- 申请号：TW105101390 申请日：2016-01-18
- 公开(公告)号：TW201630064A 公开(公告)日：2016-08-16
- 发明人： 阿爾瓦雷斯戴維 , ALVAREZ, DAVID , 艾特金森吉姆K , ATKINSON, JIM K.
- 申请人： 應用材料股份有限公司 , APPLIED MATERIALS, INC.
- 专利权人： 應用材料股份有限公司,APPLIED MATERIALS, INC.
- 当前专利权人： 應用材料股份有限公司,APPLIED MATERIALS, INC.
- 代理人： 李世章; 彭國洋
- 优先权： 14/616,704 20150207
- 主分类号： H01L21/304
- IPC分类号： H01L21/304
Compression molded articles employing circumferential surfaces having friction-enhancing patterns to contact substrates during wet chemical processes are disclosed. An article such as an annular body may be formed by a compression molding technique. By including a patterned surface as part of an outer circumferential surface of the annular body, frictional contact between the annular body and the substrate may be enhanced as friction-reducing fluids associated with a wet chemical processes may be directed away from the desired friction contact area between the annular body and the substrate. In this manner, frictional contact may be enhanced and the substrate may be effectively positioned and moved during the wet chemical process to improve the effectively of the process.
公开/授权文献:
- TWI689002B 利用具有摩擦增強圖案的周邊表面在濕式化學製程期間接觸基板的壓模製品 公开/授权日：2020-03-21
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/18 | ...器件有由周期表第Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料 |
| --------------H01L21/26 | ....用波或粒子辐射轰击的 |
| ----------------H01L21/302 | .....改变半导体材料的表面物理特性或形状的，例如腐蚀、抛光、切割 |
| ------------------H01L21/304 | ......机械处理，例如研磨、抛光、切割 |