基本信息:
- 专利标题： ＳＭＴ型ＬＥＤ封裝元件、其製作方法及發光裝置
- 专利标题（英）：SMT type LED package component, manufacturing method thereof and luminous device
- 专利标题（中）：ＳＭＴ型ＬＥＤ封装组件、其制作方法及发光设备
- 申请号：TW103138526 申请日：2014-11-06
- 公开(公告)号：TW201618334A 公开(公告)日：2016-05-16
- 发明人： 許維彬 , 林德揚
- 申请人： 崇得電子股份有限公司 , SINOGERMAN ENTERPRISE CO., LTD
- 申请人地址： 新北市
- 专利权人： 崇得電子股份有限公司,SINOGERMAN ENTERPRISE CO., LTD
- 当前专利权人： 崇得電子股份有限公司,SINOGERMAN ENTERPRISE CO., LTD
- 当前专利权人地址： 新北市
- 代理人： 林志青
- 主分类号： H01L33/48
- IPC分类号： H01L33/48
An SMT type LED package component comprises: a combination of an LED chip and metal stands; and a package body. Two metal stands in the combination are spaced by an interval and parallel to a first axial direction and have a first end electrically connected with the LED chip and an opposite second end. The package body includes: a lens part that is connected as a whole and encapsulating the LED chip and the first end of the metal stands; and a supporting part. The supporting part has a bottom surface away from the lens part. A plurality of points of the bottom surface co-define a supporting end located at a predetermined assembling plane. The second end of the two metal stands and the supporting end are coplanar. Accordingly, the SMT type LED package component has feature capable of standing so as to be suitable for SMT process.
公开/授权文献:
- TWI559577B ＳＭＴ型ＬＥＤ封裝元件、其製作方法及發光裝置 公开/授权日：2016-11-21