基本信息:
- 专利标题： 半導體封裝件及其製法
- 专利标题（英）：Semiconductor package and method of manufacture
- 专利标题（中）：半导体封装件及其制法
- 申请号：TW103133457 申请日：2014-09-26
- 公开(公告)号：TW201613048A 公开(公告)日：2016-04-01
- 发明人： 陳彥亨 , CHEN, YAN HENG , 林畯棠 , LIN, CHUN TANG , 詹慕萱 , CHAN, MU HSUAN , 紀傑元 , CHI, CHIEH YUAN
- 申请人： 矽品精密工業股份有限公司 , SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 申请人地址： 臺中市
- 专利权人： 矽品精密工業股份有限公司,SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人： 矽品精密工業股份有限公司,SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人地址： 臺中市
- 代理人： 陳昭誠
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/56
This invention provides a method for manufacturing a semiconductor package, the method including providing a carrier member having a plurality of grooves formed thereon and a plurality of carrying bodies, wherein a plurality of electronic elements are disposed on each of the carrier bodies; disposing each of the carrier bodies respectively into the groves such that the electronic components protrude from the carrier member; forming a package material on the carrier member to cover the electronic elements; removing the carrier bodies and the carrier member; and performing a singulation process. The carrier bodies and the grooves are designed to divide the whole structure surface into packaging blocks of the required size so as to facilitate the subsequent singulation process to be performed by the existing machines for cost reduction. The invention further provides the semiconductor package as described above.
公开/授权文献:
- TWI552293B 半導體封裝件及其製法 公开/授权日：2016-10-01
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/48 | .用于向或自处于工作中的固态物体通电的装置，例如引线、接线端装置 |