基本信息:
- 专利标题： 用於修改基板表面的掠射角電漿處理
- 专利标题（英）：Grazing angle plasma processing for modifying a substrate surface
- 专利标题（中）：用于修改基板表面的掠射角等离子处理
- 申请号：TW104106870 申请日：2015-03-04
- 公开(公告)号：TW201603098A 公开(公告)日：2016-01-16
- 发明人： 葛迪魯多維 , GODET, LUDOVIC , 葉怡利 , YIEH, ELLIE Y. , 奈馬尼史林尼法斯D , NEMANI, SRINIVAS D. , 迪可森蓋瑞E , DICKERSON, GARY E. , 瑞斗瓦諾夫史維特拉納B , RADOVANOV, SVETLANA B. , 班德亞當 , BRAND, ADAM
- 申请人： 應用材料股份有限公司 , APPLIED MATERIALS, INC.
- 专利权人： 應用材料股份有限公司,APPLIED MATERIALS, INC.
- 当前专利权人： 應用材料股份有限公司,APPLIED MATERIALS, INC.
- 代理人： 蔡坤財; 李世章
- 优先权： 61/949,841 20140307;61/989,370 20140506
- 主分类号： H01J37/147
- IPC分类号： H01J37/147 ; H01J37/08 ; H01J37/32
Embodiments of the disclosure provide apparatus and methods for modifying a surface of a substrate using a plasma modification process. In one embodiment, a process generally includes the removal and/or redistribution of a portion of an exposed surface of the substrate by use of an energetic particle beam while the substrate is disposed within a particle beam modification apparatus. Embodiments may also provide a plasma modification process that includes one or more pre-planarization processing steps and/or one or more post-planarization processing steps that are all performed within one processing system. Some embodiments may provide an apparatus and methods for planarizing a surface of a substrate by performing all of the plasma modification processes within either the same processing chamber, the same processing system or within processing chambers found in two or more processing systems.
公开/授权文献:
- TWI690968B 用於修改基板表面的掠射角電漿處理 公开/授权日：2020-04-11
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01J | 放电管或放电灯 |
| ------H01J37/00 | 有把物质或材料引入使受到放电作用的结构的电子管,如为了对其检验或加工的 |
| --------H01J37/02 | .零部件 |
| ----------H01J37/04 | ..电极装置及与产生或控制放电的部件有关的装置，如电子光学装置，离子光学装置 |
| ------------H01J37/147 | ...沿所需路径导引或偏转电子流的装置 |