To provide an alignment mark at a position that overlaps the region in which an anisotropic electroconductive film is affixed, and to accurately perform alignment using an image captured by a camera. An alignment method in which an electronic component (18) is mounted on the obverse surface of a transparent substrate (12) with an electroconductive adhesive (1) interposed therebetween, a substrate-side alignment mark (21) and a component-side alignment mark (22) are imaged from the reverse surface side of the transparent substrate (12), the positions of alignment marks (21, 22) are adjusted from the captured image, and the position at which the electronic component (18) is mounted on the transparent substrate (12) is aligned, wherein in the electroconductive adhesive (1), electroconductive particles (4) are in a regular arrangement as viewed from above, and in the captured image, the outside edges of the alignment marks (21, 22) exposed between the electroconductive particles (4) are intermittently visible as line segments (S) along the imaginary line segments of the outside edges of the alignment marks (21, 22).