This anisotropic conductive film, which can suppress a decrease in conduction reliability resulting from storage in high-temperature, high-humidity environments, and suppresses the occurrence of short circuiting when electrical components having a narrowed pitch are connected in an anisotropic conductive manner, has at least a structure such that a conductive-particle-containing layer, which comprises conductive particles arrayed in a monolayer in a layer-shaped binder resin composition, is laminated on a first insulating resin composition layer. Here, the minimum melt viscosity of the binder resin composition is at least the minimum melt viscosity of the first insulating resin composition. Also, a second insulating resin composition layer is preferably further laminated at the surface of the conductive-particle-containing layer at the reverse side from the first insulating resin composition layer. In such a case, the minimum melt viscosity of the binder resin composition is higher than the minimum melt viscosity of the first and second insulating resin compositions.