The invention provides an accommodating device for electronic devices, a manufacturing method and a single-chip device thereof. The accommodating tool manufactures a resin sheet through using a forming mold for reversing the shape of the resin sheet, and can accommodate single-chip electronic devices in a grid shape. Room-temperature-curable liquid resin is supplied to the forming mold which is provided with an inner chamber that corresponds with the resin sheet. The inner chamber is internally provided with a projection which corresponds with a grid-shaped recess of the resin sheet. Resin is solidified on condition that the upper surface of a metal platform is immersed in the resin which fills the inner chamber, thereby forming cured resin. Therefore, the metal platform adheres with the resin sheet which is made of the solidified resin, thereby manufacturing the accommodating tool with the grid-shaped recess. Through using the forming mold, the recess of the resin sheet can form a grid-shaped member in stead of a grid-flag-shaped member, and furthermore all single-chip electronic devices are accommodated in the grid-shaped recess.