基本信息:
- 专利标题： 軟性電路板及其接地線結構
- 专利标题（英）：Flexible circuit board and ground line structure
- 专利标题（中）：软性电路板及其接地线结构
- 申请号：TW102105900 申请日：2013-02-20
- 公开(公告)号：TW201434357A 公开(公告)日：2014-09-01
- 发明人： 白育彰 , PAI, YU CHANG
- 申请人： 聯詠科技股份有限公司 , NOVATEK MICROELECTRONICS CORP.
- 申请人地址： 新竹縣
- 专利权人： 聯詠科技股份有限公司,NOVATEK MICROELECTRONICS CORP.
- 当前专利权人： 聯詠科技股份有限公司,NOVATEK MICROELECTRONICS CORP.
- 当前专利权人地址： 新竹縣
- 代理人： 詹銘文; 葉璟宗
- 主分类号： H05K1/02
- IPC分类号： H05K1/02
A ground line structure adapted to a flexible circuit board is provided. The ground line structure includes a plurality of ground line structure units located on the flexible circuit board to form a meshed pattern. The ground line structure units include a plurality of ground line edge segments, a ground line middle segment and a plurality of ground line connecting segments. The ground line edge segments define the shape of each ground line structure unit. The shape of each ground line structure unit is a hexagon. The ground line connecting segments are configured to connect the ground line middle segment and the ground line edge segments. The ground line edge segments, the ground line middle segment and the ground line connecting segments form a plurality of pentagonal electrode structures within the hexagonal ground line structure unit. Furthermore, a flexible circuit board including the foregoing ground line structure is also provided.
公开/授权文献:
- TWI457055B 軟性電路板及其接地線結構 公开/授权日：2014-10-11
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |