基本信息:
- 专利标题： 處理ＯＬＥＤ元件之方法
- 专利标题（英）：Methods for processing OLED devices
- 专利标题（中）：处理ＯＬＥＤ组件之方法
- 申请号：TW102145161 申请日：2013-12-09
- 公开(公告)号：TW201422442A 公开(公告)日：2014-06-16
- 发明人： 貝爾曼羅伯特艾倫 , BELLMAN, ROBERT ALAN , 布可白德丹娜克瑞格 , BOOKBINDER, DANA CRAIG , 曼利羅伯喬治 , MANLEY, ROBERT GEORGE , 瑪贊德普蘭汀 , MAZUMDER, PRANTIK
- 申请人： 康寧公司 , CORNING INCORPORATED
- 专利权人： 康寧公司,CORNING INCORPORATED
- 当前专利权人： 康寧公司,CORNING INCORPORATED
- 代理人： 蔡坤財; 李世章
- 优先权： 61/736,871 20121213;14/047,514 20131007
- 主分类号： B32B7/04
- IPC分类号： B32B7/04 ; B32B7/02 ; C03C27/10 ; H01L27/12
Methods for making electronic devices on thin sheets (20) bonded to carriers (10). A surface modification layer (30) and associated heat treatments, may be provided on a sheet (20), a carrier (10), or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier during the electronic device processing. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, during the electronic device processing. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, during the electronic device processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.
公开/授权文献:
- TWI604955B 處理ＯＬＥＤ元件之方法 公开/授权日：2017-11-11
信息查询:
EspacenetIPC结构图谱:
| B | 作业；运输 |
| --B32 | 层状产品 |
| ----B32B | 层状产品，即由扁平的或非扁平的薄层，例如泡沫状的、蜂窝状的薄层构成的产品 |
| ------B32B7/00 | 以薄层之间的联系为特征的层状产品，即基本上包含具有不同物理性质薄层的产品，或以薄层之间的相互连接为特征的产品 |
| --------B32B7/04 | .以薄层之间的连接为特征的 |