基本信息:
- 专利标题： 用於接合應用的銀合金線
- 专利标题（英）：Silver alloy wire for bonding applications
- 专利标题（中）：用于接合应用的银合金线
- 申请号：TW102129346 申请日：2013-08-15
- 公开(公告)号：TW201418484A 公开(公告)日：2014-05-16
- 发明人： 柳在成 , RYU, JAE-SUNG , 鄭恩均 , CHUNG, EUN-KYUN , 卓容德 , TARK, YONG-DEOK
- 申请人： 賀利氏材料科技公司 , HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- 专利权人： 賀利氏材料科技公司,HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- 当前专利权人： 賀利氏材料科技公司,HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- 代理人： 陳長文
- 优先权： 12006236.9 20120904
- 主分类号： C22C5/06
- IPC分类号： C22C5/06 ; H01L21/60 ; B21C1/00 ; C21D9/52
The invention is related to a bonding wire, comprising: a core with a surface, wherein the core comprises silver as a main component and at least one member selected from the group consisting of gold, palladium, platinum, rhodium, ruthenium, nickel, copper and iridium, characterized in that the bonding wire has at least one of the following properties: (i) an average size of crystal grains of the core is between 0.8 &mgr; m and 3 &mgr; m, (ii) the amount of crystal grains having an orientation in <001> direction in the cross section of the wire is in the range of 10 - 20%, (iii) the amount of crystal grains having an orientation in <111> direction in the cross section of the wire is in the range of 5 - 15%, and (iv) the total amount of crystal grains having an orientation in <001> direction and of crystal grains having an orientation in <111> direction in the cross section of the wire is in the range of 15 - 40%.
公开/授权文献:
- TWI532857B 用於接合應用的銀合金線 公开/授权日：2016-05-11