基本信息:
- 专利标题: 具有貼合結構的電子裝置及其製造方法
- 专利标题(英):Electronic device with laminated structure and manufacturing method thereof
- 专利标题(中):具有贴合结构的电子设备及其制造方法
- 申请号:TW101108033 申请日:2012-03-09
- 公开(公告)号:TW201316868A 公开(公告)日:2013-04-16
- 发明人: 林越展 , 章旭 , 黃偉
- 申请人: 宸陽光電科技(廈門)有限公司
- 专利权人: 宸陽光電科技(廈門)有限公司
- 当前专利权人: 宸陽光電科技(廈門)有限公司
- 代理人: 賴經臣; 宿希成
- 优先权: 201110324524.2 20111015
- 主分类号: H05K3/36
- IPC分类号: H05K3/36 ; B32B37/12
The present disclosure relates to an electronic device, and more particularly, to an electronic device with laminated structure and a manufacturing method thereof. The electronic device comprises: a first substrate; a second substrate; and a solid-state adhesive layer, wherein the adhesive layer is disposed between the first substrate and the second substrate. The solid-state adhesive layer reacts with the first substrate and the second substrate to form a chemically linked chain for bonding the first substrate and the second substrate. The present disclosure further selects a solid-state adhesive with both physical and chemical cohesiveness to laminate the two substrates: thereby making an electronic device more firm with higher shock resistance.
公开/授权文献:
- TWI527509B 具有貼合結構的電子裝置 公开/授权日:2016-03-21
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K3/00 | 用于制造印刷电路的设备或方法 |
--------H05K3/36 | .印刷电路与其他印刷电路的组装 |