基本信息:
- 专利标题： 雙面相機組件
- 专利标题（英）：Dual-facing camera assembly
- 专利标题（中）：双面相机组件
- 申请号：TW101129095 申请日：2012-08-10
- 公开(公告)号：TW201314843A 公开(公告)日：2013-04-01
- 发明人： 陳剛 , CHEN, GANG , 沙哈 亞雪許 , SHAH, ASHISH , 毛 杜立 , MAO, DULI , 戴幸志 , TAI, HSIN CHIH , 羅狄絲 霍華E , RHODES, HOWARD E.
- 申请人： 豪威科技股份有限公司 , OMNIVISION TECHNOLOGIES, INC.
- 专利权人： 豪威科技股份有限公司,OMNIVISION TECHNOLOGIES, INC.
- 当前专利权人： 豪威科技股份有限公司,OMNIVISION TECHNOLOGIES, INC.
- 代理人： 陳長文
- 优先权： 13/235,121 20110916
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L25/065
Embodiments of the invention relate to a camera assembly including a rear-facing camera and a front-facing camera operatively coupled together (e.g., bonded, stacked on a common substrate). In some embodiments of the invention, a system having an array of frontside illuminated (FSI) imaging pixels is bonded to a system having an array of backside illuminated (BSI) imaging pixels, creating a camera assembly with a minimal size (e.g., a reduced thickness compared to prior art solutions). An FSI image sensor wafer may be used as a handle wafer for a BSI image sensor wafer when it is thinned, thereby decreasing the thickness of the overall camera module. According to other embodiments of the invention, two package dies, one a BSI image sensor, the other an FSI image sensor, are stacked on a common substrate such as a printed circuit board, and are operatively coupled together via redistribution layers.
公开/授权文献:
- TWI566338B 成像裝置，成像系統及製造雙面相機組件之方法 公开/授权日：2017-01-11
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/02 | .容器；封接 |