The present invention relates to a halogen-free pressure-sensitive adhesive composition, based on the total weight of the composition, comprising (A) 15-60wt% of acrylic-based polymer, (B) 10-50wt% of thermally conductive filler, and (C) 20-50wt% of halogen-free flame retardant, based on 100wt% of the total weight of the composition, wherein the component (C) comprises: sub-component (C1) comprising at least one organophosphorous-based flame retardant; and sub-component (C2) comprising at least one flame retardant selected from the group consisting of nitrogen-containing compound-based flame retardants, graphite material-based flame retardants, melamine cyanurate-based flame retardants, metal hydroxide-based flame retardants, metal oxide-based flame retardants, metal phosphate-based flame retardants and metal borate-based flame retardants, and organophosphate-based flame retardants other than the organophosphorous-based flame retardants of (C1), and the composition has a P content no less than 4.0wt%, based on 100wt% of the total weight of the composition. A halogen-free pressure-sensitive adhesive tape and an adhesion structure are also provided.