发明专利
TW201240761A 焊料轉印基材、焊料轉印基材之製造方法、及焊料轉印方法 SOLDER TRANSFERRING SUBSTRATE, MANUFACTURING METHOD OF SOLDER TRANSFERRING SUBSTRATE, AND SOLDER TRANSFERRING METHOD
审中-公开
基本信息:
- 专利标题： 焊料轉印基材、焊料轉印基材之製造方法、及焊料轉印方法 SOLDER TRANSFERRING SUBSTRATE, MANUFACTURING METHOD OF SOLDER TRANSFERRING SUBSTRATE, AND SOLDER TRANSFERRING METHOD
- 专利标题（英）：Solder transferring substrate, manufacturing method of solder transferring substrate, and solder transferring method
- 专利标题（中）：焊料转印基材、焊料转印基材之制造方法、及焊料转印方法 SOLDER TRANSFERRING SUBSTRATE, MANUFACTURING METHOD OF SOLDER TRANSFERRING SUBSTRATE, AND SOLDER TRANSFERRING METHOD
- 申请号：TW101104903 申请日：2012-02-15
- 公开(公告)号：TW201240761A 公开(公告)日：2012-10-16
- 发明人： 櫻井大輔
- 申请人： 松下電器產業股份有限公司
- 申请人地址： PANASONIC CORPORATION 日本 JP
- 专利权人： 松下電器產業股份有限公司
- 当前专利权人： 松下電器產業股份有限公司
- 当前专利权人地址： PANASONIC CORPORATION 日本 JP
- 代理人： 惲軼群; 陳文郎
- 优先权： 日本 2011-073235 20110329
- 主分类号： B23K
- IPC分类号： B23K ; H05K
In order to provide a solder transfer base which enables a transfer without breaking a fragile film of a semiconductor element that has a fragile dielectric film, the present invention provides a solder transfer base (5), which is provided with a base layer (1), an adhesive layer (2) that is arranged on the base layer (1), and a plurality of solder particles (3) that are arranged on the adhesive layer (2). The base layer (1) is a porous member, and is provided with a plurality of pores that pass through at least a remover liquid from the side on which the adhesive layer (2) is not arranged to the side on which the adhesive layer (2) is arranged. In addition, the adhesive layer (2) has such a characteristic that the adhesive layer (2) is expanded when the remover liquid is injected thereinto.
公开/授权文献:
- TWI579096B 焊料轉印基材、焊料轉印基材之製造方法、及焊料轉印方法 公开/授权日：2017-04-21
信息查询:
EspacenetIPC结构图谱:
| B | 作业；运输 |
| --B23 | 机床；不包含在其他类目中的金属加工 |
| ----B23K | 钎焊或脱焊；焊接；用钎焊或焊接方法包覆或镀敷；局部加热切割，如火焰切割；用激光束加工 |