发明专利
TW201224107A 導電性接著劑組成物、電子裝置、陽極積層體及電子裝置之製造方法 CONDUCTIVE ADHESIVE COMPOSITION, ELECTRONIC DEVICE, ANODE LAMINATE AND METHOD FOR PRODUCING ELECTRONIC DEVICE
审中-公开
基本信息:
- 专利标题： 導電性接著劑組成物、電子裝置、陽極積層體及電子裝置之製造方法 CONDUCTIVE ADHESIVE COMPOSITION, ELECTRONIC DEVICE, ANODE LAMINATE AND METHOD FOR PRODUCING ELECTRONIC DEVICE
- 专利标题（英）：Conductive adhesive composition, electronic device, anode laminate and method for producing electronic device
- 专利标题（中）：导电性接着剂组成物、电子设备、阳极积层体及电子设备之制造方法 CONDUCTIVE ADHESIVE COMPOSITION, ELECTRONIC DEVICE, ANODE LAMINATE AND METHOD FOR PRODUCING ELECTRONIC DEVICE
- 申请号：TW100134494 申请日：2011-09-26
- 公开(公告)号：TW201224107A 公开(公告)日：2012-06-16
- 发明人： 加藤邦久 , 武藤豪志 , 中島惠美
- 申请人： 琳得科股份有限公司
- 申请人地址： LINTEC CORPORATION 日本 JP
- 专利权人： 琳得科股份有限公司
- 当前专利权人： 琳得科股份有限公司
- 当前专利权人地址： LINTEC CORPORATION 日本 JP
- 代理人： 何金塗; 丁國隆
- 优先权： 日本 2010-220319 20100930
- 主分类号： C09J
- IPC分类号： C09J ; B32B
The present invention provides a conductive adhesive composition, which has an excellent adhesiveness and a low surface resistance and can be used as a buffer layer of an electronic device. The conductive adhesive composition of the present invention comprises (A) a water soluble polyvinyl polymer, (B) an organic additive and (C) a conductive organic polymer compound, and is characterized in that: (B) the organic additive is selected from at least one of a water soluble polyalcohol, water soluble pyrrolidones or hydrophilic aprotic solvents and (C) the conductive organic polymer compound is selected from at least one of polyanilines, polypyrroles or polythiophenes and derivates thereof. Moreover, according to the present invention, it can provide an electronic device that has a conductive layer comprising the forementioned conductive adhesive composition, an anode laminate formed by laminating a conductive layer comprising the said conductive adhesive composition, and a method for producing the electronic device.
公开/授权文献:
- TWI488940B 電子裝置及電子裝置之製造方法 公开/授权日：2015-06-21