基本信息:
- 专利标题： 微尺度冷卻裝置及方法 MICROSCALE COOLING APPARATUS AND METHOD
- 专利标题（英）：Microscale cooling apparatus and method
- 专利标题（中）：微尺度冷却设备及方法 MICROSCALE COOLING APPARATUS AND METHOD
- 申请号：TW098126036 申请日：2009-08-03
- 公开(公告)号：TW201014515A 公开(公告)日：2010-04-01
- 发明人： 帝特門 馬修 , 李永青 , 蕭浩揚 , 李世里
- 申请人： 管路極微公司
- 申请人地址： PIPELINE MICRO, INC. 美國 US
- 专利权人： 管路極微公司
- 当前专利权人： 管路極微公司
- 当前专利权人地址： PIPELINE MICRO, INC. 美國 US
- 代理人： 洪武雄; 陳昭誠
- 优先权： 美國 61/086,419 20080805 美國 61/156,465 20090227 美國 12/511,945 20090729
- 主分类号： H05K
- IPC分类号： H05K
A method and system for providing a heat sink assembly are described. The assembly includes a two-phase heat sink, a condenser, and a pump. The two-phase heat sink may include flow micro-channels that accommodate the flow of boiling coolant and cross-connect channel(s) that at least partially equilibrate a pressure field for the boiling coolant. The condenser receives coolant from the heat sink and removes heat. The pump drives coolant through the assembly. In one aspect, the assembly is a closed system for the coolant. In another aspect, the condenser includes first and second plates and a heat exchange surface there between. Coolant flows from the heat sink and through the plates. The gaseous coolant passes the heat exchange surface. In one aspect the gaseous coolant flows opposite to the direction coolant flows. In one aspect, at least one of the plates includes dummy channel(s) for insulating part of the plate(s).
公开/授权文献:
- TWI415558B 用於冷卻電子裝置之散熱片組件 公开/授权日：2013-11-11
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |