基本信息:
- 专利标题： 用於打線接合之方法與裝置 METHOD AND DEVICE FOR WIRE BONDING
- 专利标题（英）：Method and device for wire bonding
- 专利标题（中）：用于打线接合之方法与设备 METHOD AND DEVICE FOR WIRE BONDING
- 申请号：TW097146529 申请日：2008-11-28
- 公开(公告)号：TW200939372A 公开(公告)日：2009-09-16
- 发明人： 恩斯特 旺可 WANDKE, ERNST , 克里斯多夫 羅曼 LAUMEN, CHRISTOPH , 裴潘林 HIEW, PANG LING , 陳邦 TAN, BOON ANN
- 申请人： 林德股份公司 LINDE AG
- 申请人地址： 德國
- 专利权人： 林德股份公司 LINDE AG
- 当前专利权人： 林德股份公司 LINDE AG
- 当前专利权人地址： 德國
- 代理人： 陳長文
- 优先权： 德國 102007057429.2 20071129
- 主分类号： H01L
- IPC分类号： H01L ; B23K
The invention relates to a device for wire bonding with a copper-containing bonding wire (2) for connecting a component (9) to a support (7), wherein provision is made in each case on the component (9) as well as on the support (7) for at least one bond pad (4), encompassing a guide (1) for the bonding wire and a device (3) for melting a part of a bonding wire (2), which is provided for a connection to one of the bond pads (4), wherein the guide (1) for the bonding wire (2) is embodied in such a manner that the melted part of the bonding wire (2) is brought into contact in each case with at least one bond pad (4) in a bonding chamber (5), characterized in that provision is made for at least one plasma nozzle (6), with the help of which the part of the bonding wire (2), which is provided for the connection to the bond pad (4) and/or the bond pad (4) and/or the bonding chamber (5) can be acted upon by a plasma. Furthermore, the invention relates to a method for wire bonding.